epoxy encapsulation

Contact NowBlack Epoxy Resin for Electronic Components EncapsulationEpoxy resin 588AB is a black epoxy potting resin, can be cured under normal temperature and low temperature, with good flowing property, natural defoaming, it can also be cured at high temperature. Application 588AB can be widely used for electronics potting, power...Read More

Contact NowWhite Epoxy Resin for Electronic Components EncapsulationEpoxy resin 688AB is a white epoxy potting resin, can be cured under normal temperature and high temperature, with the feature of good flowing property, and high gloss surface. Application 688AB can be widely used for electronics potting, power encapsulation, mold...Read More

Contact NowClear Epoxy Resin for PottingEpoxy resin 2120AB-25D can be cured under normal temperature and low temperature, with the feature of high transparency, low viscosity.. Application 2120AB-25D can be widely used for drops of glue, handmade jewelry, underwater lamp potting and mold filling, etc.....Read More