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Home > Product > epoxy encapsulation

epoxy encapsulation


  • Clear Epoxy Resin for Potting

    Contact NowClear Epoxy Resin for PottingEpoxy resin 2120AB-25D can be cured under normal temperature and low temperature, with the feature of high transparency, low viscosity.. Application 2120AB-25D can be widely used for drops of glue, handmade jewelry, underwater lamp potting and mold filling, etc.....Read More

  • White Epoxy Resin for Electronic Components Encapsulation

    Contact NowWhite Epoxy Resin for Electronic Components EncapsulationEpoxy resin 688AB is a white epoxy potting resin, can be cured under normal temperature and high temperature, with the feature of good flowing property, and high gloss surface. Application 688AB can be widely used for electronics potting, power encapsulation, mold...Read More

  • Black Epoxy Resin for Electronic Components Encapsulation

    Contact NowBlack Epoxy Resin for Electronic Components EncapsulationEpoxy resin 588AB is a black epoxy potting resin, can be cured under normal temperature and low temperature, with good flowing property, natural defoaming, it can also be cured at high temperature. Application 588AB can be widely used for electronics potting, power...Read More

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Shenzhen Jinhua Electronic Materials Co.,Ltd

Add:3rd Floor, Building B, Yufeng Industrial Park, Jiangshi Road, Gongming Town, Guangming New District, Shenzhen, China

Pho:86-13823546652

Tel:86-755-27124868

Fax:86-755-27128206

E-mail:sales@bestepoxyresin.com

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